US semiconductor giant intel will expand its chip packaging and testing base in Chengdu, reports Hong Kong's South China Morning Post.
In a show of commitment to the mainland market, the California company will inject US$300 million into its local unit, Intel Products (Chengdu).
The Chengdu facility will also establish a 'customer solutions centre to improve the efficiency of the local supply chain, increase support for Chinese customers and improve response time,' Intel China said on its WeChat account.
The Santa Clara, California-based company will inject $300 million into its local entity, Intel Products (Chengdu), to support the expansion, according to a WeChat post published by the city's Reform and Development Commission.
Launched in 2003, Intel's Chengdu plant is responsible for the packaging and testing of more than half of the company's laptop processors shipped worldwide. Packaging and testing is the final step in semiconductor manufacturing, ensuring the quality and reliability of a product.
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In a show of commitment to the mainland market, the California company will inject US$300 million into its local unit, Intel Products (Chengdu).
The Chengdu facility will also establish a 'customer solutions centre to improve the efficiency of the local supply chain, increase support for Chinese customers and improve response time,' Intel China said on its WeChat account.
The Santa Clara, California-based company will inject $300 million into its local entity, Intel Products (Chengdu), to support the expansion, according to a WeChat post published by the city's Reform and Development Commission.
Launched in 2003, Intel's Chengdu plant is responsible for the packaging and testing of more than half of the company's laptop processors shipped worldwide. Packaging and testing is the final step in semiconductor manufacturing, ensuring the quality and reliability of a product.
SeaNews Turkey
